Researchers from the University of Tokyo developed a new technology to bond polyimide films to glass so it can easily be peeled off by applying heat. Polyimide is widely used today as a flexible OLED substrate, which is indeed produced on glass and then de-laminated at the end of the deposition process. This is an expensive process today (which requires a laser) with low yields. The new bonding technology (which they call surface activated bonding) makes it easier to remove the polyimide film. In the new process an argon io beam is used to remove the oxide and adsorption films and flatten the surfaces. A 5-20 nm thick silicon layer is formed between the glass and the polyimide by ion beam sputtering. An iron adhesion layer (1 nm thick) is formed on the silicon to reinforce the bonding. Read more about Researchers develop a cost-effective way to bond polyimide to glass for flexible OLED production

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Researchers develop a cost-effective way to bond polyimide to glass for flexible OLED production