IDTechEx estimates that the barrier (encapsulation) layers for flexible electronics market will reach over $200 million by 2024. This will be driven mostly by flexible OLED displays for phones, tablets and wearables. Following is details regarding the different technologies adopted by Samsung, LG and others. Samsung is using Vitex’s multilayer thin-film encapsulation (TFE) using three layers (this is a new achievement, up until now they had to use at least 6 layers ). While Samsung will still use this technology for its current and netx-gen displays, Samsung is also considering other encapsulation deposition technologies, including Veeco’s FAST-ALD and Universal Display’s UniversalBarrier . Read more about IDTechEx sees a $200 million encapsulation for flexible electronics market by 2024

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IDTechEx sees a $200 million encapsulation for flexible electronics market by 2024